PuriKen Co., Ltd. Printed Circuit Board Copper Plating
Filled with copper plating inside the laser-processed beer hall! Introducing equipment for processes such as filled plating.
Our company performs "copper plating" using process equipment. In the plating room, we remove smears inside through holes and via holes, and to achieve good adhesion between resin and copper, we carry out the "desmear process" to roughen the resin. We also implement the "electroless copper plating (chemical copper plating) process" to allow current to flow inside through holes and via holes through electrolytic copper plating. Additionally, the "electrolytic copper plating (copper sulfate plating) process" involves placing an anode and cathode electrode in a solution containing copper ions and flowing current through the solution to precipitate Cu metal onto the cathode. 【Processes】 ■ Desmear process ■ Electroless copper plating (chemical copper plating) process ■ Electrolytic copper plating (copper sulfate plating) process ■ Filled plating *For more details, please refer to the PDF document or feel free to contact us.
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
